For the customer that wishes to apply an embedded solution, connectBlue offers a wide range of low-power modules, fully certified and pre-tested as well as a full range of Accessories. Have a look at our Bluetooth products, Wireless LAN products and IEEE 802.15.4 / ZigBee products.
If you want to learn more on various wireless use cases, wireless technology comparison, what makes connectBlue unique and the technical differences between the connectBlue wireless products and modules, have a look in our Wireless Selection Guide.
Getting started when you have purchased a connectBlue module is easy. Let us show you how you begin through this tutorial video.
FEATURES OVERVIEW
Bluetooth version: v4.0 Low Energy single-mode
Interface: GPIO, SPI, UART, I2C
Profiles: Customer implemented
Size: 15x22mm
Connectors: Solder pads, JST
Antenna: Integrated or external
Output power: 3dBm
Range: 200m
Android support: Yes
iPhone support: Yes
Others: Complete stand-alone module with (optional) battery, temp sensor, accelerometers, LEDs, push button. Platform for custom developed application/services.
FEATURES OVERVIEW
Bluetooth version: v2.1 (v3.0 ready)
Interface: UART logic level
Profiles: SPP, DUN
Size: 16x36mm
Connectors: Solder pads, board-to-board
Antenna: Integrated or external
Output power: 4dBm
Range: 150m
Android support: Yes
iPhone support: No
Others:
FEATURES OVERVIEW
Bluetooth version: v2.1+EDR (v3.0 ready)
Interface: UART logic level
Profiles: SPP, DUN, PAN
Size: 16x36mm
Connectors: Solder pads, board-to-board, JST
Antenna: Integrated or external
Output power: 4dBm
Range: 150m
Android support: Yes
iPhone support: Yes, via external Apple Authentication co-processor.
Others: Multipoint connections with 3 slaves. Custom developed applications can be embedded. Bluetooth repeater. Analog/digital I/O support via special firmware.
FEATURES OVERVIEW
Bluetooth version: v2.1+EDR (v4.0 low energy dual-mode ready)
Interface: UART logic level
Profiles: SPP, DUN, PAN
Size: 16x36mm
Connectors: Solder pads, board-to-board, JST
Antenna: Integrated or external
Output power: 10 dBm
Range: 300m
Android support: Yes
iPhone support: Yes, via external Apple Authentication co-processor and special firmware.
Others: Multipoint connections with 7 slaves. Prepared for Bluetooth Low Energy (v4.0). High throughput. Bluetooth repeater.
FEATURES OVERVIEW
Bluetooth version: v2.1+EDR (v3.0 ready)
Interface: UART, RS232
Profiles: SPP, DUN, PAN
Size: 23x36mm
Connectors: Board-to-board, 20 pin header, solder pads, JST
Antenna: Integrated or external
Output power: 17dBm
Range: 1000m
Android support: Yes
iPhone support: Yes, via external Apple Authentication co-processor.
Others: Multipoint connections with 7 slaves, full throughput. Very high throughput. Repeater.
FEATURES OVERVIEW
Bluetooth version: v2.1+EDR (v3.0 ready)
Interface: 16 digital IOs, 4 ADC channels
Profiles: SPP
Size: 16x36mm
Connectors: Solder pads, board-to-board
Antenna: Integrated or external
Output power: 4dBm
Range: 150m
Android support: Yes
iPhone support: Please contact us
Others: Analog/digital IOs, Multipoint connections with 3 slaves
FEATURES OVERVIEW
Bluetooth version: v2.1+EDR (v3.0 ready)
Interface: UART logic level
Profiles: SPP, PAN
Size: 23x36mm
Connectors: Solder pads, board-to-board
Antenna: Integrated or external
Output power: 4dBm
Range: 150m
Android support: Yes
iPhone support: Yes. Integrated Apple Authentication co-processor.
Others: Multipoint connections with 3 slaves. Custom developed applications can be embedded. Bluetooth repeater. Analog/digital I/O support via special firmware.
For repeat orders, please feel free to place an order. If you are looking for a new design implementation, please contact us prior to placing your order so that we can find the best solution for your needs.
Main features:
Both the Bluetooth MAC (Media Access Control) address and the individual radio tuning parameter are stored directly in the modules. Also, the two HCI modules are already radio tested and fine-tuned as well as have high input sensitivity and high output power.
FEATURES OVERVIEW
Interface: SPI
Radio: Dual-band, 802.11abgn
2.4 GHz channels: 1-13
5 GHz channels: 36-48
Type: LAN module up to MAC layer
Driver: Linux, WinCE, embedded systems
Connectors: Board-to-board, 20-pin header
Temp. range: -30 to +85 C
Approvals: FCC, IC, R&TTE
Read more
FEATURES OVERVIEW
Interface: SDIO
Radio: Dual-band, 802.11abgn
2.4 GHz channels: 1-13
5 GHz channels: 36-48
Type: LAN module up to MAC layer
Driver: Linux, WinCE
Connectors: Board-to-board, 20-pin header
Temp. range: -30 to +85 C
Approvals: FCC, IC, R&TTE
Read more
FEATURES OVERVIEW
Interface: UART
Radio: Dual-band, 802.11abgn
2.4 GHz channels: 1-13
5 GHz channels: 36-48, 52-140*
Type: Serial Port Module with embedded driver and stack
Driver: Built-in
Connectors: Board-to-board, Solder pads
Temp. range: -40 to +85 C
Approvals: FCC, IC, R&TTE
Read more
* In progress
FEATURES OVERVIEW
Interface: SPI
Radio: Dual-band, 802.11abgn
2.4 GHz channels: 1-13
5 GHz channels: 36-48, 52-140*
Type: LAN module up to MAC layer
Driver: Linux, WinCE, embedded systems
Connectors: Board-to-board, Solder pads
Temp. range: -40 to +85 C
Approvals: FCC, IC, R&TTE
* In progress
The connectBlue IEEE 802.15.4 OEM module OZS311, share form factor and electrical interface with the connectBlue Bluetooth and Wireless LAN product ranges. The module is equipped with the connectBlue Serial Port Adapter firmware and can be embedded with a ZigBee application layer and/or customer developed applications.
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